If you have a team to design PCB, PACCOM can take care of the rest for you. If you don't, please first see our memory design service.
PACCOM knows how important it is for you to have a good assembly house. This is why PACCOM is here to serve you.
For each new Memory OEM order, a task force formed by experts from engineering, production, quality, procurement, and sales is immediately mobilized to prepare all the setup before mass production. Stencil design, engineering preparation and validation, production equipment setup, tuning of process parameters, tailor-made quality control plan and pilot-run are all in place to enable us to deliver reliable and consistent quality. Moreover, all consigned materials including PCB, memory chips, SPD program, packing materials are well managed by our custom designed ERP system and our efficient logistics team.
All products are manufactured in an ESD-protected plant with environmentally safe "no clean" process. Our plant is equipped with sophisticated automatic facilities such as tape-to-tray robot, vision-based screen printer, pick-and-place machine, high-end reflow oven, optical inspection system, tester with automatic handler, and x-ray inspection system. They are used to assemble modules with memory chips of various packages (e.g. SOJ, TSOP, FBGA); to handle lead-free (Pb-free) assembly using lead-free and halogen-free raw materials; to manufacture high capacity modules by stacking chips.
PACCOM implements quality management system in compliance with MIL and IPC standards. PACCOM has also put in place an operations management system in accordance with ISO9001:2000 quality management system standards. Our stringent quality assurance program ensures high speed and various lot sizes manufacturing with no compromise on product quality.
